The deadline to apply to this international collaboration EU-Japan call on semiconductors is now extended to December 8th.
The call aims to address the major challenges facing the semiconductor industry by supporting the development of advanced chip architectures and manufacturing technologies to meet the growing demands of artificial intelligence (AI). It focuses on strengthening the chiplet ecosystem through heterogeneous integration, particularly 2.5D and 3D packaging, integrated photonics, and the standardisation of chiplet interfaces to improve interoperability, performance, and energy efficiency.
The scope includes the development of innovative integration processes, chiplet co-optimisation, interface design, through-silicon vias, interposers, and advanced bonding techniques. Projects are expected to bring together industry, academia, and research organisations, with strong collaboration between European and Japanese partners, to bridge the gap between research and industrial application. Solutions should be demonstrated in laboratory and pilot environments, ideally reaching Technology Readiness Levels (TRLs) 5–7, and deliver tangible benefits for European industry through knowledge transfer, stakeholder engagement, and contributions to global semiconductor standards.
To read all the call documents follow the link: Call Details
